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Aims & Scope

Virtual Reality & Intelligent Hardware (VRIH) is an open access journal that aims to showcase and promote distinguished research in the field of virtual reality and intelligent hardware. It provides a global publishing and academic exchange platform for researchers, professionals and industry practitioners. The journal offers high-quality single-blind peer review and is published bimonthly in English. Submissions are welcome on a variety of topics-specific areas of interest include, but are not limited to:

  • 5G and VR/AR/MR

  • Artificial intelligence for VR/AR/MR

  • Audio interfaces, sound rendering and auditory perception

  • Brain interface

  • Computer graphics techniques

  • Computer vision techniques

  • Content creation, authoring and management

  • Conversational and speech interfaces

  • Crowd simulation

  • Display technologies

  • Embodied agents, virtual humans and (self-)avatars

  • Haptic and tactile interfaces, wearable haptics, passive haptics, pseudo haptics

  • Human augmentations

  • Human-computer interaction for VR/AR/MR

  • Human factors and ergonomics

  • Image analysis and video processing

  • Immersive analytics and visualization techniques

  • Input devices

  • Locomotion and navigation

  • Machine learning and deep learning

  • Mediated and diminished reality

  • Medical simulation and navigation

  • Modeling and simulation

  • Multi-user and distributed systems

  • Multimodal capturing and reconstruction

  • Multimodal/cross-modal interaction and perception

  • Multisensory rendering, registration, and synchronization

  • Perception and cognition

  • Presence, body ownership, and agency

  • Scene description and management issues

  • Sensor fusion

  • Software architectures, toolkits, and engineering

  • Storytelling

  • Teleoperation and telepresence

  • Touch, tangible and gesture interfaces

  • Tracking and sensing

  • Usage research, evaluation methods and empirical studies

  • VR/AR/MR applications


Description

Virtual Reality & Intelligent Hardware (VRIH, ISSN 2096-5796, CN10-1561/TP) is a bimonthly Chinese-English bilingual journal managed by the Chinese Academy of Sciences and published by Beijing Zhongke Journal Publishing Co., Ltd. It was established by China Science Publishing & Media Ltd. (Science Press) and Beihang University and is co-organized by Goertek Inc. The editor-in-chief is Professor Wang Yongtian from Beijing Institute of Technology. 

Editorial Board

Advisors
Qinping ZHAOBeihang University,   China
Bohu LIBeihang University,   China
Qionghai DAITsinghua University,   China
Guozhong DAIInstitute of Software, CAS, China


Overseas   Advisors
Mark BILLINGHURSTSchool of Information  Technology and Mathematical Sciences, Australia
Hiroo IWATAUniversity of Tsukuba, Japan
Ji QIANGRensselaer  Polytechnic Institute, USA
David REMPEL  University of  California, USA
Bjoern SCHULLERImperial College  London, UK
Dieter SCHMALSTIEGInstitute of Computer Graphics and Vision at Graz University of Technology, Austria
Enhua WU University of Macao, China
Shin-Tson WUUniversity of Central Florida, USA


Editor-in-Chief 
Yongtian WANGBeijing Institute of   Technology, China


Associate Editors
Hujun BAOZhejiang University, China
Xilin CHENInstitute of Computing Technology, CAS, China
Aimin HAOBeihang University, China
Shimin HUTsinghua University, China
Bin SHENGShanghai Jiaotong University, China
Aiguo SONGSoutheast University, China
Xiaoying SUNJilin University, China
Jianhua TAOInstitute of Automation, CAS, China
Feng TIANInstitute of Software, CAS, China
Guoping WANGPeking University, China


Editorial Board 
Chi Kit AUUniversity of  Waikato, New Zealand
Mehdi AMMIUniversité Paris-Sud 11, France
Lei BIThe University of Sydney, Australia
Marc BAADENNational Centre for Scientific Research, France
Andrés Navarro CADAVIDUniversidad ICESI, Colombia
Yiyu CAI    Nanyang Technological University, Singapore
Zhanchuan CAIMacau University of   Science and Technology, China
Sanxing CAOCommunication University of China, China
Yanlong CAOZhejiang University, China
Tolga CAPINTED University, Turkey
Jian CHANGBournemouth University, UK
Baoquan CHENPeking University, China
Dongyi CHENUniversity of Electronic Science and Technology of China, China
Leiting CHENUniversity of Electronic Science and Technology of China, China
Yanyun CHENInstitute of Software, CAS, China
Yuanfei CHENInstitute of Computing Technology, CAS Branch of Tianjin, China
Dewen CHENGBeijing Institute of Technology, China
Lianglun CHENGGuangdong University of Technology, China
Xiaoyu CHIGoertek Group Co.,Ltd., China                                                                         
Adrian CLARKUniversity of Canterbury, New Zealand
Weiwen DENGJilin University, China
Qi DOUThe Chinese University of Hong Kong, China
Henry DUHLa Trobe University, Australia
Xiumin FANShanghai Jiao Tong   University, China
Guangzheng FEICommunication University of China, China
Dagan FENGThe University of  Sydney, Australia
Hongbo FUCity University of Hong Kong, China
Arnulph FUHRMANNTH Köln, Germany 
Li GUOHunan University, China
Song GUOHong Kong Polytechnic University, China
Yuan-Sheng GUOMinistry of Industry and Information Technology, China
Yong HANOcean University of China, China
Pheng Ann HENGThe Chinese University of Hong Kong,   China
Zengguang HOUInstitute of Automation, CAS, China
Guoquan HUANGUniversity of Delaware, USA
Qiang HUANGBeijing Institute of Technology, China
Xiangyang JITsinghua University, China
Jinyuan JIATongji University, China
Younhyun JUNGGachon University, South Korean
Manolya   KAVAKLIMacquarie University, Australia
Jinman KIMThe University of Sydney, Australia
Kiyoshi KIYOKAWA Nara Institute of Science and Technology, Japan
Hoshang KOLIVANDLiverpool John Moores University, UK
Lingsheng KONGChangchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Yoshihiro   KURODAUniversity of   Tsukuba, Japan 
Robert Steven   LARAMEEUniversity of   Nottingham, UK
Manfred LAUCity University of   Hong Kong, China
Frederich LIUniversity of Durham, UK
Haifeng LIZhejiang University, China
Ping LIThe Hong Kong Polytechnic University, China
Weiping LIPeking University, China
Xueming LIBeijing University of Posts and Telecommunications, China
Yuanqing LISouth China University of Technology, China
Baoquan LIUHuawei Institute of the United Kingdom, UK
Xiaohui LIANGBeihang University, China
Minglei LIUIntelligent   Manufacturing Hundred People Association of China, China
Yanli LIUSichuan University, China
Yongjin LIUTsinghua University, China
Yue LIUBeijing Institute of Technology, China
Xun LUOTianjin University of Technology, China
Zhihan LVQingdao University, China
Xiaoyang MAOUniversity of Yamanashi, Japan
Khan MUHAMMADSejong University, South Korean
Andrés Adolfo Navarro NEWBALL Pontificia Universidad Javeriana Cali, Colombia
Zhigeng PANHangzhou Normal University, China
George PAPAGIANNAKISUniversity of Crete, Greece
Christine PEREYPerey Research and Consulting, Switzerland
Isidoros PERIKOSUniversity of Patras, Greece
Xiaojuan QIThe University of  Hong Kong, China
Yue QIBeihang University, China
Jing QINThe Hong Kong Polytechnic University, China
Abdennour El RHALIBILiverpool John Moores University, UK
Umesh RAMNARAINUniversity of Johannesburg, South Africa
Abdennour El RHALIBILiverpool John Moores University, UK
Tanzila SABAPrince Sultan University, Saudi Arabia
Abdul SADKABrunel University London, UK
Shaojie SHENUniversity of Pennsylvania, Hong Kong 
Xukun SHENBeihang University, China
Yuanchun SHITsinghua University, China
Quanjun SONGHefei Institute of Intelligent Machinery, CAS, China
Weitao SONGBeijing Institute of Technology, China
Sud SUDIRMANLiverpool John Moores University, UK
Simon SUArmy Research Laboratory, USA
Markus TATZGERNSalzburg University of Applied Sciences, Austria
Bruce THOMEASThe University of South Australia Mawson Lakes, Australia
Changhe TUShandong University, China
Haruo TAKEMURACybermedia Center Osaka University, Japan
Cong WANGChina Institute of Electronic Technology Standardization, China
Dangxiao WANGBeihang University, China
Gregory F WELCHThe University of Central Florida, USA
Lejin WANGPeking University People's Hospital, China
Wei WANGBeihang University, China
Zhaoqi WANGInstitute of   Computing Technology, CAS, China
Dongdong WENGBeijing Institute of   Technology, China
Jing XUIntelligent   Manufacturing Hundred People Association of China, China
Mingliang XUZhengzhou University, China
Yingqing XUTsinghua University, China
Zhenbang XUChangchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Le XIEShanghai Jiao Tong University, China
Lun XIEUniversity of Science and Technology Beijing, China
Jianru XUEXi'an JiaoTong University, China
Jian YANGBeijing Institute of Technology, China
Po YANGSheffield University, UK
Hongqing (Harry) YUUniversity of Derby, UK
Jingyi YUShanghai University of Science and Technology, China
Yang YUGoertek Group Co.,Ltd., China                                                                     
Hongbin ZHAPeking University, China
Fengjun ZHANGInstitute of Software, CAS, China
Ping ZHANGSouth China University of Technology, China
Xin ZHANGChangchun Institute of Optics, Fine Mechanics and Physics, CAS, China
Yanguo ZHANGChina Communications   Industry Association, China
Yu ZHANGStanford University, USA
Yunquan ZHANGInstitute of   Computing Technology, CAS, China
Guofeng ZHANGZhejiang University, China
Jianmin ZHENGNanyang Technological University, Singapore
Bin ZHOUBeihang University,  China
Kun ZHOUZhejiang University, China
Mingquan ZHOUBeijing Normal University, China
Zhong ZHOUBeihang University, China
Zihan ZHOUPenn State University, USA


Contact us

Yuan QI     Tel: +86-10-64010640

Rui-Chao CHEN     Tel: +86-10-64034563

E-mail: vrih@vip.163.com

Address:16 Donghuangchenggen North Street, Beijing, 100717. P. R. China